The Chinese University of Hong Kong (CUHK) has established a new research centre in collaboration with the National University of Singapore, under the third InnoHK research cluster, SEAM@InnoHK, after receiving approval from the Innovation and Technology Commission (ITC) of the HKSAR Government. The Centre for Heterogeneous Integration and Production (CHIP) is led by Professor Chen Shih-Chi from the Department of Mechanical and Automation Engineering at CUHK, and Professor Xu Jianbin and Professor Zhao Ni from the Department of Electronic Engineering. CHIP focuses on advancing next-generation electronics through innovations in semiconductor equipment and material processing, with a focus on advancing heterogeneous integration technologies.

As the semiconductor industry moves beyond Moore’s Law [1], 3D heterogeneous integration has become essential to enhance the performance and functionality of modern electronics. Constructing silicon 3D-ICs at the nanoscale requires highly precise tools that are currently unavailable, while the integration of emerging semiconductors – such as 2D materials, metal oxides, and mixed ionic-electronic conductors – demands new equipment and scalable fabrication processes.

CHIP’s research is structured into three synergistic research programmes, each with a distinct focus and objective:

• Research Programme 1 focuses on developing enabling precision fabrication and metrology equipment, including wafer bonding systems, 2D lithography platforms, and laser etching machines, to set new benchmarks in speed, accuracy, and scalability for 3D and photonic ICs.
• Research Programme 2 focuses on foundational material engineering and advanced packaging solutions, including bonding technology, chip cooling, and 2D material integration, enabling heterogeneous integration at an industrial scale.
• Research Programme 3 targets the creation of new devices and systems enabled by heterogeneous integration, including electronic-photonic co-ICs, back-end-of-line (BEOL)-compatible devices, 2D material-silicon hybrid optoelectronic chips, and flexible sensing modules. Together, these programmes align closely with the roadmap of global heterogeneous integration development, addressing critical challenges in semiconductor manufacturing while enabling new applications in AI, high-performance computing, robotics, artificial reality, virtual reality, and beyond.

CHIP’s mission is to tackle these challenges by delivering impactful, real-world solutions that enhance efficiency, scalability, and sustainability, positioning Hong Kong and the Chinese Mainland as global leaders in advanced manufacturing and electronic materials.

[1] Beyond Moore’s Law lies the technologies, focusing on heterogeneous integration (3D chip stacking), specialized architectures (AI/neuromorphic chips), and new materials (silicon photonics, graphene) rather than simply shrinking transistors.

Professor Chen Shih-Chi

CUHK Press Release: CUHK establishes new InnoHK Research Centre to advance next-generation semiconductor manufacturing and electronic materials